FLOW OF WATER-BASED Cu, CuO, AND Al2O3 NANOFLUIDS HEATED WITH CONSTANT HEAT FLUX BETWEEN MICROPIPE

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dc.authorscopusid57524148500
dc.contributor.authorŞimşek, Hatice
dc.date.accessioned2023-04-20T08:02:31Z
dc.date.available2023-04-20T08:02:31Z
dc.date.issued2022
dc.departmentMeslek Yüksekokulları, Teknik Bilimler Meslek Yüksekokulu, Makine ve Metal Teknolojileri Bölümü
dc.description.abstractThis study aims to analytically measure the fully developed laminar flow and heat transfer the water-based nanofluids, Cu, CuO, and Al2O3, within a micropipe with constant heat flux, under the temperature jump and slip rate boundary conditions. Knudsen number, nanoparticle volumes, and ratios of liquid layer thickness to particle radius are assumed, 0, 0.02, 0.04; 0%, 4%, %8, and 0.1, 0.2, 0.4, respectively. The findings suggest that adding nanoparticles to flow area has significant effect on both the velocity field and the heat transfer. There is a significant decline in the velocity both at the core and on the walls in the velocity area, due to the increase in the solid volume and the ratios of liquid layer thickness to particle radius after adding nanoparticles to flow area, and the increase of Nusselt number is significantly proportional to that of the solid volume and the ratios of liquid layer thickness to particle radius. Among the nanoparticles, Cu, CuO, and Al2O3, used as nanofluids within the micropipe, Cu is found to be the one with the highest heat transfer enhancement, followed by Al2O3, and CuO, respectively.
dc.identifier.doi10.2298/TSCI2204941S
dc.identifier.endpage2954
dc.identifier.issn0354-9836
dc.identifier.issn2334-7163
dc.identifier.issue4en_US
dc.identifier.scopus2-s2.0-85135077098
dc.identifier.scopusqualityQ3
dc.identifier.startpage2941
dc.identifier.urihttps://doi.org/10.2298/TSCI2204941S
dc.identifier.urihttps://hdl.handle.net/20.500.11776/10980
dc.identifier.volume26
dc.identifier.wosWOS:000833183200010
dc.identifier.wosqualityQ4
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.institutionauthorŞimşek, Hatice
dc.language.isoen
dc.publisherVinca Inst Nuclear Sci
dc.relation.ispartofThermal Science
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/openAccess
dc.subjectMicropipe
dc.subjectNanofluid
dc.subjectWater
dc.subjectCu
dc.subjectCuo
dc.subjectAl2o3
dc.subjectSlip Flow
dc.subjectSlip Factor
dc.subjectNusselt Number
dc.subjectTemperature-Jump
dc.subjectSlip Velocity
dc.subjectMagnetic-Field
dc.subjectPressure-Drop
dc.subjectMicrochannel
dc.subjectSink
dc.subjectPermeability
dc.subjectSimulation
dc.titleFLOW OF WATER-BASED Cu, CuO, AND Al2O3 NANOFLUIDS HEATED WITH CONSTANT HEAT FLUX BETWEEN MICROPIPE
dc.typeArticle

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