FLOW OF WATER-BASED Cu, CuO, AND Al2O3 NANOFLUIDS HEATED WITH CONSTANT HEAT FLUX BETWEEN MICROPIPE
dc.contributor.author | Şimşek, Hatice | |
dc.date.accessioned | 2023-04-20T08:02:31Z | |
dc.date.available | 2023-04-20T08:02:31Z | |
dc.date.issued | 2022 | |
dc.identifier.issn | 0354-9836 | |
dc.identifier.issn | 2334-7163 | |
dc.identifier.uri | https://doi.org/10.2298/TSCI2204941S | |
dc.identifier.uri | https://hdl.handle.net/20.500.11776/10980 | |
dc.description.abstract | This study aims to analytically measure the fully developed laminar flow and heat transfer the water-based nanofluids, Cu, CuO, and Al2O3, within a micropipe with constant heat flux, under the temperature jump and slip rate boundary conditions. Knudsen number, nanoparticle volumes, and ratios of liquid layer thickness to particle radius are assumed, 0, 0.02, 0.04; 0%, 4%, %8, and 0.1, 0.2, 0.4, respectively. The findings suggest that adding nanoparticles to flow area has significant effect on both the velocity field and the heat transfer. There is a significant decline in the velocity both at the core and on the walls in the velocity area, due to the increase in the solid volume and the ratios of liquid layer thickness to particle radius after adding nanoparticles to flow area, and the increase of Nusselt number is significantly proportional to that of the solid volume and the ratios of liquid layer thickness to particle radius. Among the nanoparticles, Cu, CuO, and Al2O3, used as nanofluids within the micropipe, Cu is found to be the one with the highest heat transfer enhancement, followed by Al2O3, and CuO, respectively. | en_US |
dc.language.iso | eng | en_US |
dc.publisher | Vinca Inst Nuclear Sci | en_US |
dc.identifier.doi | 10.2298/TSCI2204941S | |
dc.rights | info:eu-repo/semantics/openAccess | en_US |
dc.subject | Micropipe | en_US |
dc.subject | Nanofluid | en_US |
dc.subject | Water | en_US |
dc.subject | Cu | en_US |
dc.subject | Cuo | en_US |
dc.subject | Al2o3 | en_US |
dc.subject | Slip Flow | en_US |
dc.subject | Slip Factor | en_US |
dc.subject | Nusselt Number | en_US |
dc.subject | Temperature-Jump | en_US |
dc.subject | Slip Velocity | en_US |
dc.subject | Magnetic-Field | en_US |
dc.subject | Pressure-Drop | en_US |
dc.subject | Microchannel | en_US |
dc.subject | Sink | en_US |
dc.subject | Permeability | en_US |
dc.subject | Simulation | en_US |
dc.title | FLOW OF WATER-BASED Cu, CuO, AND Al2O3 NANOFLUIDS HEATED WITH CONSTANT HEAT FLUX BETWEEN MICROPIPE | en_US |
dc.type | article | en_US |
dc.relation.ispartof | Thermal Science | en_US |
dc.department | Meslek Yüksekokulları, Teknik Bilimler Meslek Yüksekokulu, Makine ve Metal Teknolojileri Bölümü | en_US |
dc.identifier.volume | 26 | en_US |
dc.identifier.issue | 4 | en_US |
dc.identifier.startpage | 2941 | en_US |
dc.identifier.endpage | 2954 | en_US |
dc.institutionauthor | Şimşek, Hatice | |
dc.relation.publicationcategory | Makale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı | en_US |
dc.authorscopusid | 57524148500 | |
dc.identifier.wos | WOS:000833183200010 | en_US |
dc.identifier.scopus | 2-s2.0-85135077098 | en_US |
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